如何切削玻璃材料？

How to cut glass materials?

　　玻璃的成分中含有锗、硅等半导体材料。优于它具有比钢铁更高的硬度，而脆性又很大，因此属于一种不容易加工的材料。对玻璃常见的切削加工种类包括切割、研磨、抛光、钻孔和外圆加工等工序。下面我们就来介绍一下，各个工序需要注意的事项。

The composition of glass contains semiconductor materials such as germanium and silicon. Compared to steel, it has a higher hardness and greater brittleness, making it a material that is not easy to process. The common types of cutting and processing for glass include cutting, grinding, polishing, drilling, and outer circle processing. Below we will introduce the precautions that need to be taken in each process.

　　玻璃的切割

Cutting of glass

　　切割厚度在3毫米以下的玻璃板，最简单有效的方法就是：用金刚石玻璃刀或者是其他坚硬物质在玻璃表面手工刻划，利用刻痕处应力集中的特性，用手即可掰断。这也是最常用的手工切割玻璃的方式。

The simplest and most effective way to cut glass panels with a thickness of less than 3 millimeters is to manually scratch the glass surface with a diamond glass knife or other hard material. By taking advantage of the stress concentration at the scratch, it can be easily broken by hand. This is also the most commonly used method of manually cutting glass.

　　玻璃的机械切割一般是采用薄铁板或不锈钢薄片制成的圆锯片，并且在切削过程中加入了磨料和水。常用的磨料为粒度在400号左右的碳化硅或金刚石。在切割圆形半导体晶片的时候，由于晶片厚度极小，只有0.4毫米，因此需要极高的切割精度。这时候就需要采用环形圆锯片，利用锯片内圆周对棒状锭料进行切割，切缝宽度约为0.1到0.2毫米。另外，圆形晶片也可以采用超声波切割。而方形晶片一般是先用薄片砂轮直接划出划痕，然后摺断。

The mechanical cutting of glass generally uses circular saw blades made of thin iron plates or stainless steel sheets, and abrasive and water are added during the cutting process. The commonly used abrasives are silicon carbide or diamond with a particle size of around 400. When cutting circular semiconductor chips, extremely high cutting accuracy is required due to the extremely thin thickness of the chip, which is only 0.4 millimeters. At this point, it is necessary to use a circular saw blade to cut the rod-shaped ingot material using the inner circumference of the saw blade, with a cutting seam width of about 0.1 to 0.2 millimeters. In addition, circular chips can also be cut using ultrasonic waves. Square chips, on the other hand, are usually first scratched with a thin grinding wheel and then folded.

　　玻璃的研磨和抛光

Grinding and polishing of glass

　　对于玻璃材料的研磨和抛光工作原理与金属材料相差不大。研磨压强通常在1000到3000帕斯卡，研磨用的磨料粒度为5到20号的石英砂、刚玉、碳化硅或碳化硼，水与磨料的比例大概为1:2。

The working principle of grinding and polishing glass materials is not much different from that of metal materials. The grinding pressure is usually between 1000 and 3000 Pascals, and the abrasive used for grinding is quartz sand, corundum, silicon carbide, or boron carbide with a particle size of 5 to 20. The ratio of water to abrasive is approximately 1:2.

　　经过研磨的玻璃表面会形成半透明的细毛面，并存在4到5微米深的凹凸层，想要得到光泽表面必须要经过抛光处理。抛光盘通常采用毛毡、呢绒或塑料作为材料，并使用直径在5微米以下，粒度在5号以下的氧化铁、氧化铈和氧化锆等微粉作为磨料。研磨时需要加等量的水，并制成悬浮液作为抛光剂，5到20摄氏度是最理想的工作环境温度。

The surface of the ground glass will form a semi transparent fine textured surface, with a concave convex layer of 4 to 5 microns deep. To obtain a glossy surface, polishing treatment is necessary. Polishing discs usually use felt, woolen fabric, or plastic as materials, and use micro powders such as iron oxide, ceria, and zirconia with a diameter of less than 5 microns and a particle size of less than 5 as abrasives. When grinding, an equal amount of water needs to be added and made into a suspension as a polishing agent. The ideal working environment temperature is between 5 and 20 degrees Celsius.

　　抛光需要去除的厚度约在20微米左右，约占研磨去除量的10%。但是，由于抛光工序的精密性，其所耗费的工时却要比研磨长得多。

The thickness that needs to be removed by polishing is about 20 microns, accounting for about 10% of the grinding removal amount. However, due to the precision of the polishing process, it requires much longer working hours than grinding.

　　切削玻璃材料的常用加工方法及其注意事项

Common processing methods and precautions for cutting glass materials

　　玻璃的钻孔

Drilling holes in glass

　　在玻璃上钻孔时，随着孔径和形状的差异，所采用的方法也是不同的。当孔径在5毫米以下时，常采用的是冲击钻孔法。一方面用硬质合金圆凿以每分钟2000转的速度钻削，与此同时，通过电磁振荡器使圆凿在玻璃表面施加6000赫兹的振动冲击。这种方法双管齐下，拥有很高的加工效率，要钻出一个2毫米孔径、5毫米孔深5的小孔，一般只需要10秒左右就可以完成。

When drilling holes on glass, the method used varies depending on the difference in aperture and shape. When the aperture is below 5 millimeters, the commonly used method is impact drilling. On the one hand, a hard alloy chisel is used to drill at a speed of 2000 revolutions per minute, while at the same time, an electromagnetic oscillator is used to apply a vibration impact of 6000 hertz to the glass surface of the chisel. This method has a dual approach and high processing efficiency. It usually takes only about 10 seconds to drill a small hole with a diameter of 2mm and a depth of 5mm.

　　如果要钻削的是孔径在5毫米以上的中控或大孔时，通常采用端部开槽的铜管或钢管作为钻头，以每分钟30米的切削速度进行钻削，与此同时，还要在工作部位注入碳化硅或金刚石磨料以及润滑油。钻削时，玻璃要放置在毛毡或橡胶垫上，并保证垫平，以防压碎。而对于对方孔和异形孔，通常采用频率在18000到24000赫兹的超声波加工。

When drilling central control or large holes with a diameter of 5 millimeters or more, copper or steel pipes with slotted ends are usually used as drill bits, with a cutting speed of 30 meters per minute. At the same time, silicon carbide or diamond abrasive and lubricating oil should be injected into the working area. When drilling, the glass should be placed on a felt or rubber pad and kept flat to prevent crushing. For square and irregular holes, ultrasonic machining with frequencies ranging from 18000 to 24000 Hz is usually used.

　　玻璃的外圆加工

Outer circle processing of glass

　　玻璃的外圆加工通常采用磨削方式，砂轮材料为碳化硅。或者还可采用车削方式加工，车削转速在每分钟2000转左右，车刀材料为金刚石或硬质合金。采用硬质合金车刀时，前角角度应该为负数。

The outer circle of glass is usually processed by grinding, and the grinding wheel material is silicon carbide. Alternatively, turning can be used, with a turning speed of around 2000 revolutions per minute, and the cutting tool material being diamond or hard alloy. When using hard alloy turning tools, the front angle should be negative.

以上就是有关  中空玻璃生产线 的介绍，想了解更多的内容请点击：http://www.jncsjx.com  我们将会全心全意为您提供满分服务，欢迎您的来电！

The above is an introduction to the production line of insulated glass. To learn more, please click: http://www.jncsjx.com We will wholeheartedly provide you with full score service. Welcome to call us!