自动点胶机使用的注意事项，在使用中会出现工艺缺陷：胶点大小不合格、针头大小、针头与PCB板间的距离、胶水温度、胶水的粘度、拉丝、胶水浸染焊盘、固化强度不好易掉片等。解决这些问题应整体研究各项技术工艺参数，从而找到解决问题的办法。
Precautions for the use of automatic dispensing machine, there will be process defects in use: unqualified glue point size, needle size, distance between needle and PCB board, glue temperature, glue viscosity, wire drawing, glue dip pad, poor curing strength, easy to drop pieces, etc. To solve these problems, it is necessary to study the technical parameters as a whole, so as to find a solution.
1．点胶量的大小
1. The amount of dispensing

根据工作经验，胶点直径的大小应为焊盘间距的一半，贴片后胶点直径应为胶点直径的1.5倍。这样就可以保证有充足的胶水来粘结元件又避免过多胶水浸染焊盘。点胶量多少由螺旋泵的旋转时间长短来决定，实际中应根据生产情况（室温、胶水的粘性等）选择泵的旋转时间。
According to the working experience, the size of the glue spot diameter should be half of the pad spacing, and the glue spot diameter after the chip is pasted should be 1.5 times of the glue spot diameter. In this way, enough glue can be used to bond the components and too much glue can be avoided to contaminate the pad. The amount of dispensing depends on the rotation time of the screw pump. In practice, the rotation time of the pump should be selected according to the production situation (room temperature, glue viscosity, etc.).
2．点胶压力（背压）
2. Dispensing pressure (back pressure)
目前所用点胶机采用螺旋泵供给点胶针头胶管采取一个压力来保证足够胶水供给螺旋泵。背压压力太大易造成胶溢出、胶量过多；压力太小则会出现点胶断续现象，漏点，从而造成缺陷。应根据同品质的胶水、工作环境温度来选择压力。环境温度高则会使胶水粘度变小、流动性变好，这时需调低背压就可保证胶水的供给，反之亦然。
At present, the dispensing machine adopts screw pump to supply the dispensing needle, and the rubber tube adopts a pressure to ensure enough glue to supply screw pump. If the back pressure is too high, it is easy to cause glue overflow and too much glue; if the pressure is too low, it will cause intermittent dispensing and leakage, resulting in defects. The pressure should be selected according to the same quality glue and working environment temperature. When the ambient temperature is high, the viscosity of glue will be reduced and the fluidity will be improved. At this time, the back pressure should be lowered to ensure the supply of glue, and vice versa.
3．针头大小
3. Needle size
在工作实际中，针头内径大小应为点胶胶点直径的1/2，点胶过程中，应根据PCB上焊盘大小来选取点胶针头：如0805和1206的焊盘大小相差不大，可以选取同一种针头，但是对于相差悬殊的焊盘就要选取不同针头，这样既可以保证胶点质量，又可以提高生产效率。
In the actual work, the inner diameter of the needle should be 1 / 2 of the diameter of the dispensing point. In the dispensing process, the dispensing needle should be selected according to the size of the pad on the PCB: for example, the pad sizes of 0805 and 1206 are similar, so the same kind of needle can be selected, but different needles should be selected for the pad with great difference, which can not only ensure the quality of the dispensing point, but also improve the production efficiency.
4．针头与PCB板间的距离
4. Distance between needle and PCB
不同的点胶机采用不同的针头，有些针头有一定的止动度（如CAM/A LOT 5000）。每次工作开始应做针头与PCB距离的校准，即Z轴高度校准。
Different dispensers use different needles, some of which have a certain degree of stop (such as cam / a lot 5000). The distance between the needle and PCB should be calibrated at the beginning of each work, that is z-axis height calibration.
5．胶水温度
5. Glue temperature
一般环氧树脂胶水应保存在0--5℃的冰箱中，使用时应提前1/2小时拿出，使胶水充分与工作温度相符合。胶水的使用温度应为23℃--25℃；环境温度对胶水的粘度影响很大，温度过低则会胶点变小，出现拉丝现象。环境温度相差5℃，会造成50％点胶量变化。因而对于环境温度应加以控制。同时环境的温度也应该给予保证，湿度小胶点易变干，影响粘结力。
Generally, the epoxy resin glue should be kept in the refrigerator at 0-5 ℃, and should be taken out 1 / 2 hour in advance to make the glue fully conform to the working temperature. The use temperature of glue should be 23 ℃ -- 25 ℃; the ambient temperature has a great influence on the viscosity of glue. If the temperature is too low, the glue point will become smaller and wire drawing phenomenon will appear. The environmental temperature difference of 5 ℃ will cause the change of 50% dispensing amount. Therefore, the ambient temperature should be controlled. At the same time, the temperature of the environment should also be guaranteed, the humidity is small, the adhesive point is easy to dry, affecting the adhesion.
6．胶水的粘度
6. Viscosity of glue
胶的粘度直接影响点胶的质量。粘度大，则胶点会变小，甚至拉丝；粘度小，胶点会变大，进而可能渗染焊盘。点胶过程中，应对不同粘度的胶水，选取合理的背压和点胶速度。
The viscosity of glue directly affects the quality of dispensing. If the viscosity is high, the adhesive point will become smaller, even wire drawing; if the viscosity is low, the adhesive point will become larger, and then the pad may be stained. In the dispensing process, the reasonable back pressure and dispensing speed should be selected for different viscosities of glue.
7．固化温度曲线
7. Curing temperature curve
对于胶水的固化，一般生产厂家已给出温度曲线。在实际应尽可能采用较高温度来固化，使胶水固化后有足够强度。
For the curing of glue, the general manufacturers have given the temperature curve. In practice, it should be cured at a higher temperature as far as possible, so that the glue has enough strength after curing.