锡膏属于非常粘稠的东西，怎么使用全自动点胶机进行点锡膏呢？
Solder paste is a very viscous thing, how to use the automatic dispensing machine to point solder paste? 
把锡膏分成A、B、C、D四组。A组锡膏无流向性，B组锡膏流向性一般，C组锡膏流向性可流动，D组锡膏流向性良好。
First, divide the solder paste into four groups: A, B, C and D. The flow direction of solder paste in group A was normal, that in group B was normal, that in group C was flowable, and that in group D was good.
然后采用全自动点胶搭载TS7000螺杆阀配TS500R控制器、普通点胶头和全自动点胶机搭载AS9200喷射阀和控制器二种方案进行测试。
Then the test was carried out with two schemes: automatic dispensing with ts7000 screw valve and ts500r controller, ordinary dispensing head and automatic dispensing machine with as9200 injection valve and controller.
在测试过程中发现A组无流向性的锡膏用二种方案都没有办法完成点胶。
In the process of testing, it was found that group a solder paste without flow direction could not finish dispensing with either scheme.
B组流向性一般的锡膏用全自动点胶机搭载TS7000的螺杆阀和TS500R的控制器，螺杆阀直径控制在1.3mm，在此配置下点胶效果比较稳定。
In group B, the solder paste with general flow direction is equipped with ts7000 screw valve and ts500r controller, and the screw valve diameter is controlled at 1.3mm. Under this configuration, the dispensing effect is relatively stable.
C组可流向性锡膏用全自动点胶机的二种方案进行测试，发现全自动点胶机搭载TS7000的螺杆阀和TS500R的控制器，螺杆阀直径控制在1.3mm，在此配置下点胶效果比较稳定。但全自动点胶机搭载AS9200喷射阀和控制器，喷射阀点胶直径控制在1.5mm发现喷射阀容易堵塞喷嘴。
Group C flowable solder paste was tested with two schemes of automatic dispensing machine. It was found that the automatic dispensing machine was equipped with ts7000 screw valve and ts500r controller, and the screw valve diameter was controlled at 1.3mm. Under this configuration, the dispensing effect was relatively stable. However, the automatic dispensing machine is equipped with as9200 injection valve and controller, and the dispensing diameter of the injection valve is controlled at 1.5mm. It is found that the injection valve is easy to block the nozzle.
D组流向性良好的锡膏用二种方案进行点胶的时候，点胶效果都比较稳定。
In group D, when the solder paste with good flow direction was dispensing with the two schemes, the dispensing effect was relatively stable.
由此测试可以发现，用全自动点胶机点锡膏的时候，需要对锡膏进行稀释，让其具备流向性，这样才可以用全自动点胶机进行点胶。而且流向性一般的锡膏只能用螺杆阀进行操作，流向性比较好的锡膏用喷射阀和螺杆阀都可以点锡膏。
From this test, we can find that when using the automatic dispenser to point the solder paste, we need to dilute the solder paste to make it flow, so that we can use the automatic dispenser for dispensing. And the solder paste with general flow direction can only be operated by screw valve, and the solder paste with good flow direction can be operated by spray valve and screw valve.
全自动点胶机根据锡膏特性对点胶设备配件进行选择和参数调整，避免点胶时出现断胶、出胶不均匀等现象影响点胶效果，全自动点胶机点锡膏的出现，在电子元件点锡膏应用得到了良好的反应。
According to the characteristics of solder paste, the automatic dispenser selects and adjusts the accessories of dispensing equipment to avoid the phenomenon of broken and uneven dispensing, which affects the dispensing effect. The appearance of solder paste in the automatic dispenser has a good response in the application of electronic components.